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›› 2009, Vol. 9 ›› Issue (3): 574-579.

• 材料工程专栏 • 上一篇    下一篇

含硅氢基团甲基芳炔树脂的合成及表征

张玲玲 高飞 周围 张健 黄发荣 杜磊   

  1. 华东理工大学特种功能高分子材料及其相关技术教育部重点实验室 华东理工大学特种功能高分子材料及其相关技术教育部重点实验室 华东理工大学特种功能高分子材料及其相关技术教育部重点实验室 华东理工大学特种功能高分子材料及其相关技术教育部重点实验室 华东理工大学特种功能高分子材料及其相关技术教育部重点实验室
  • 收稿日期:2009-01-16 修回日期:2009-02-27 出版日期:2009-06-20 发布日期:2009-06-20
  • 通讯作者: 黄发荣

Synthesis and Characterization of Poly(arylacetylene) Resins Containing Methylsilylene Groups

ZHANG Ling-ling GAO Fei ZHOU Wei ZHANG Jian HUANG Fa-rong DU Lei   

  1. Key Laboratory for Specially Functional Polymeric Materials and Related Technology of the Ministry of Education，East China University of Science and Technology Key Laboratory for Specially Functional Polymeric Materials and Related Technology of the Ministry of Education，East China University of Science and Technology Key Laboratory for Specially Functional Polymeric Materials and Related Technology of the Ministry of Education，East China University of Science and Technology Key Laboratory for Specially Functional Polymeric Materials and Related Technology of the Ministry of Education，East China University of Science and Technology Key Laboratory for Specially Functional Polymeric Materials and Related Technology of the Ministry of Education，East China University of Science and Technology
  • Received:2009-01-16 Revised:2009-02-27 Online:2009-06-20 Published:2009-06-20
  • Contact: HUANG Fa-rong

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摘要： 以二氯甲基硅烷和间二乙炔基苯为原料，通过格氏反应合成了不同分子量的含硅氢基团甲基芳炔树脂(PSA-H)，并分析确定了合成产物的结构. 树脂的热固化行为和固化树脂的热稳定性分析表明，PSA-H树脂具有良好的加工性能，可在较低的温度下(低于200℃)发生交联反应. 其固化物有较低的介电常数(2.57 F/m)、较低的介电损耗(tand 0.001)和优异的热稳定性，在N2气氛下5%失重温度Td5为675~703℃, 1000℃的残留率为90.9%~91.4%. PSA-H树脂固化物在氩气中1450℃下烧结可形成含b-SiC陶瓷.

关键词: 含硅芳炔树脂, 含硅氢基团树脂, 陶瓷前驱体

Abstract: A series of poly(arylacetylene) resins containing methylsilylene groups (PSA-H) were synthesized by the condensation reaction between organomagnesium reagents and dichloromethylsilane. The structures of resins were characterized. The curing behavior of PSA-H resins was traced by DSC and thermal stability of the cured resins by TGA. The results showed that the resins were easily processed and cured at temperature lower than 200℃. The cured PSA-H resins possessed low dielectric constant (2.57 F/m), low dielectric loss (tand 0.001) and excellent thermal stabiliy. Td5 (temperature at 5% weight loss) of the cured resins ranged from 675℃ to 703℃, and the char yields of cured resins at 1000℃ were 90.9%~91.4% under nitrogen. After the cured resins were sintered, b-SiC-containing ceramic was obtained.

Key words: silicon-containing poly(arylacetylene) resin, resin with methylsilylene groups, ceramic precursor

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