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过程工程学报 ›› 2018, Vol. 18 ›› Issue (3): 618-623.DOI: 10.12034/j.issn.1009-606X.217412

• 过程与工艺 • 上一篇    下一篇

Ce对Sn-58Bi合金组织与性能的影响

廖金发1, 龚留奎1, 袁大伟1, 王东东1,4, 陈辉明1,2,3*?   

  1. 1. 江西理工大学材料科学与工程学院,江西 赣州 341000;2. 江西理工大学工程研究院,江西 赣州 341000; 3. 江西省有色金属加工工程技术研究中心,江西 赣州 341000;4. 深圳理信科技有限公司,广东 深圳 518100
  • 收稿日期:2017-12-07 修回日期:2018-01-23 出版日期:2018-06-22 发布日期:2018-06-06
  • 通讯作者: 陈辉明
  • 基金资助:
    江西理工大学优秀博士学位论文培育计划资助;2017年江西理工大学学术学位研究生创新专项资金项目

Effects of Ce Addition on Microstructure and Properties of Sn-58Bi Solder Alloy

Jinfa LIAO1, Liukui GONG1, Dawei YUAN1, Dongdong WANG1,4, Huiming CHEN1,2,3?   

  1. 1. School of Materials Science and Engineering, Jiangxi University of Science and Technology, Ganzhou, Jiangxi 341000, China; 2. Institute of Engineering Research, Jiangxi University of Science and Technology, Ganzhou, Jiangxi 341000, China; 3. Jiangxi Nonferrous Metal Processing Engineering Technology Research Center, Ganzhou, Jiangxi 341000, China; 4. Shenzhen Lixin Technology Co., Ltd., Shenzhen, Guangdong 518100, China
  • Received:2017-12-07 Revised:2018-01-23 Online:2018-06-22 Published:2018-06-06

摘要: 采用真空熔炼方法制备了不同Ce含量的Sn?58Bi合金,对其显微组织、熔化特性和润湿性等进行了分析,重点研究了稀土Ce对Sn?58Bi与Cu基板焊点剪切强度的影响. 结果表明,Ce能细化Sn?58Bi合金的共晶组织,而对合金的熔点、熔程影响较小. Ce添加量增加,合金的润湿性降低,Ce添加量为0.1wt%时,Sn?58Bi/Cu焊点剪切强度最佳,达15 MPa.

关键词: Sn-58Bi无铅焊料, 显微组织, 润湿性, 剪切强度, 金属间化合物

Abstract: Sn?58Bi alloys with different Ce contents were fabricated by vacuum smelting and casting. The microstructure, phase composition and properties of the alloys were investigated. The influence of Ce on shear strength of Sn?58Bi/Cu solder joints was emphasized. The results showed that the Sn?58Bi eutectic microstructure were refined, and the melting point and melting range were less affected by Ce addition. The wettability of Sn?58Bi alloys reduced when the Ce content increased, the shear strength was maximum when the content of Ce was 0.1wt%.

Key words: Sn-58Bi lead-free solder, microstructure, wetting, shear strength, intermetallic compound