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›› 2012, Vol. 12 ›› Issue (1): 154-159.

• 材料工程专栏 • 上一篇    下一篇

乙酰丙酮镍催化含硅芳炔树脂的固化反应行为

刘海帆 邓诗峰 黄发荣 杜磊   

  1. 华东理工大学材料科学与工程学院，特种功能高分子材料及相关技术教育部重点实验室 华东理工大学材料科学与工程学院，特种功能高分子材料及相关技术教育部重点实验室 华东理工大学特种功能高分子材料及其相关技术教育部重点实验室 华东理工大学特种功能高分子材料及其相关技术教育部重点实验室
  • 收稿日期:2011-11-22 修回日期:2012-01-10 出版日期:2012-02-20 发布日期:2012-02-20
  • 通讯作者: 黄发荣

Research on Curing of a Silicon-containing Arylacetylene Resin with Nickelous Diacetyl Acetonate

LIU Hai-fan DENG Shi-feng HUANG Fa-rong DU Lei   

  1. East China University of Science and Technology, Material Science and Engineering School, Key Laboratory of Specially Functional Polymeric Materials and Related Technology of the Ministry of Educatio East China University of Science and Technology, Material Science and Engineering School, Key Laboratory of Specially Functional Polymeric Materials and Related Technology of the Ministry of Educatio Key Laboratory for Specially Functional Polymeric Materials and Related Technology of the Ministry of Education，East China University of Science and Technology Key Laboratory for Specially Functional Polymeric Materials and Related Technology of the Ministry of Education，East China University of Science and Technology
  • Received:2011-11-22 Revised:2012-01-10 Online:2012-02-20 Published:2012-02-20
  • Contact: HUANG Fa-rong

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被引次数

10

摘要： 通过凝胶时间测定、差示扫描量热分析、FT-IR分析研究了乙酰丙酮镍催化含硅芳炔树脂体系的固化反应行为，并计算了反应动力学参数. 结果表明，乙酰丙酮镍对含硅芳炔树脂固化有显著的催化作用，加入0.2%(w)乙酰丙酮镍可较大幅度降低树脂固化反应的活化能和温度，初始固化温度降低约35℃，固化反应活化能为104.2 kJ/mol，比含硅芳炔树脂的固化活化能(121.2 kJ/mol)低；乙酰丙酮镍催化含硅芳炔树脂可发生Glaser偶合、Strauss偶合、环三聚、Diels-Alder和固化反应；树脂固化物保持优异的热稳定性，在氮气气氛下5%失重温度为620℃, 1000℃时残留率为87.8%.

关键词: 含硅芳炔树脂, 乙酰丙酮镍, 固化反应动力学, 固化机理, 催化固化

Abstract: The curing reaction of silicon-containing arylacetylene resin (PSA) with nickelous diacetyl acetonate (NIAA) was studied, the curing behavior was characterized by gelation time and DSC analysis, curing kinetic parameters were calculated, the curing was traced by FT-IR. The results indicated that the catalytic effect of NIAA on PSA resin was obvious. When 0.2%(w) nickelous diacetyl acetonate was added in the resin, the apparent activity energy of curing reaction was decreased from 121.2 kJ/mol for PSA resin to 104.2 kJ/mol for PSA-NAA resin and the initial curing temperature decreased by 35℃. Glaser coupling, Strauss coupling, cyclotrimerization and Diels-Alder reaction occurred at different cuing stages of PSA-NIAA resin. The cured PSA-NIAA resin possessed excellent thermal stability. The temperature at 5% weight loss and char yield at 1000℃ of the cured resin with 0.2% NIAA were 620℃ and 87.8% under nitrogen, respectively.

Key words: silicon-containing arylacetylene resin, nickelous diacetyl acetonate, curing kinetics, curing mechanism, catalytic curing

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