多孔介质方腔内置芯片热流耦合的LBM数值模拟

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Lattice Boltzmann numerical simulation of flow thermal coupling in porous media with electronic chips

Yue CHEN Ming MA Ying ZHANG Hailong GUO Qikun WAN

Chin. J. Process Eng. . 2020, (2): 123 -132 . DOI: 10.12034/j.issn.1009-606X.219169

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