多孔介质方腔内置芯片热流耦合的LBM数值模拟
陈岳 马明 张莹 过海龙 万启坤
Lattice Boltzmann numerical simulation of flow thermal coupling in porous media with electronic chips
Yue CHEN Ming MA Ying ZHANG Hailong GUO Qikun WAN
过程工程学报
.
2020, (2): 123
-132
.
DOI: 10.12034/j.issn.1009-606X.219169
