多孔介质方腔内置芯片热流耦合的LBM数值模拟

doi:10.12034/j.issn.1009-606X.219169

过程工程学报 ›› 2020, Vol. 20 ›› Issue (2): 123-132.DOI: 10.12034/j.issn.1009-606X.219169

多孔介质方腔内置芯片热流耦合的LBM数值模拟

陈岳 ¹，马明 ²，张莹^3* ，过海龙³，万启坤³

1. 南昌大学高等研究院，江西南昌 330031 2. 圣母大学航空机械系，印第安纳州 46556，美国 3. 南昌大学机电工程学院，江西南昌 330031

收稿日期:2019-03-28 修回日期:2019-06-01 出版日期:2020-02-22 发布日期:2020-02-19
通讯作者: 张莹 yzhan2033@163.com
基金资助:
国家自然科学基金;江西省自然科学基金

Lattice Boltzmann numerical simulation of flow thermal coupling in porous media with electronic chips

Yue CHEN¹, Ming MA², Ying ZHANG^3*, Hailong GUO³, Qikun WAN³

1. Institute for Advanced Study, Nanchang University, Nanchang, Jiangxi 330031, China 2. Department of Aerospace and Mechanical Engineering, The University of Notre Dame, Indiana 46556, America 3. School of Mechatronics Engineering, Nanchang University, Nanchang, Jiangxi 330031, China

Received:2019-03-28 Revised:2019-06-01 Online:2020-02-22 Published:2020-02-19
Contact: Ying ZHANG yzhan2033@163.com
Supported by:
;Natural Science Foundation of Jiangxi Province

摘要/Abstract

摘要： 基于格子Boltzmann方法的渗流多孔介质耦合双分布模型，对表征体元（REV）尺度下含电子芯片的多孔介质自然对流进行数值模拟研究，主要研究不同物性参数对多孔介质自然对流的影响以及单电子芯片尺寸、多芯片布局等因素对电子芯片表面散热性能的影响。得出了如下研究结果：对于恒温单芯片的多孔介质自然对流，在达西数Da=10-2时存在临界芯片尺寸。在临界芯片尺寸条件下，流场扰动较更小的芯片尺寸更强，传热性能却几乎不变。不同瑞利数Ra条件下临界芯片尺寸不同，Ra越大，临界芯片尺寸越大，在Ra=103时临界芯片尺寸为0.203125倍方腔边长，Ra=104时临界芯片尺寸为0.25倍方腔边长，Ra=105时临界芯片尺寸为0.390625倍方腔边长。当多孔介质渗透率降低时，即Da=10-4时，不存在临界芯片尺寸，且芯片表面和冷壁处的平均Nusselt数均随Ra的增大而增大。对于恒温多芯片的多孔介质自然对流，在多孔介质渗透率较大(Da=10-2)的情况下芯片横排布置可取得最佳换热效果，在渗透率较小(Da=10-4)时芯片布局宜采用对角分布。

关键词: LBM, 多孔介质, 对流传热, 电子芯片

Abstract: A coupling double-distribution model was developed for simulating natural convection of porous media containing electronic chips based on the lattice Boltzmann method. The effects of different physical parameters on the natural convection of porous media were studied, and the obtained results were compared with the previous literature’s data to verify the feasibility and reliability of the current model. On this basis, effects of the size of the single electronic chip, the layout of the multiple chips, and the surface temperature fluctuation of the single chip on the heat transfer performance of the surface of the electronic chip had been comprehensively investigated. In addition, in order to quantitatively analyze the influence of various parameters on heat dissipation of the electronic chip, the average Nusselt number was employed to evaluate the heat transfer performance, and the following results were obtained: regarding the natural convection inside the porous media with a single chip under a constant temperature boundary condition had a critical chip size at Da=10-2. Under the condition of critical chip size, the distribution of the flow field was quite stronger compared with the case of a chip with a smaller size, but the heat transfer performance was almost the same. When Ra=103, the critical chip size was 0.203125 times the cavity side length, and the critical chip size was 0.25 times the cavity side length at Ra=104. And the critical chip size was 0.390625 times the cavity side length at Ra=105. When the permeability of porous media decreased, the critical chip size did not exist, and the average Nusselt number in the chip surface and the cold wall increased accordingly. For the natural convection occurred in a constant-temperature porous media with multiple-chips, the horizontal arrangement of the chips can present a high heat transfer ratio in the case of porous medium with large permeability (Da=10?2), while for the porous media with small permeability (Da=10?4), the chip layout should be diagonally distributed.

Key words: LBM, Porous media, Convection heat transfer, Electronic chips

陈岳马明张莹过海龙万启坤. 多孔介质方腔内置芯片热流耦合的LBM数值模拟[J]. 过程工程学报, 2020, 20(2): 123-132.

Yue CHEN Ming MA Ying ZHANG Hailong GUO Qikun WAN. Lattice Boltzmann numerical simulation of flow thermal coupling in porous media with electronic chips[J]. Chin. J. Process Eng., 2020, 20(2): 123-132.

参考文献

[1]Cheng Ping. Heat transfer in geothermal systems[J]. Advance in Heat Transfer, 1978,4:(1-105).
[2]Nield, D. A. and Bejan, A. Convection in Porous Media[M]. Springer, New York, 1992.
[3]何雅玲, 王勇, 李庆. 格子Boltzmann 方法的理论及应用[M]. 北京: 科学出版社,2009:1-52.
He Y L,Wang Y,Li Q.Lattice Boltzmann Method:Theory and Applications[M].Beijing:Science Press,2009:1-52.
[4]郭照立, 郑楚光. 格子 Boltzmann 方法的原理及应用[M]. 北京: 科学出版社, 2009:1-43.
Guo Z L,Zheng C G.Theory and Applications of Lattice Boltzmann Method[M].Beijing:Science Press,2009:1-43.
[5]Guo Z L, Zhao T S. A LATTICE BOLTZMANN MODEL FOR CONVECTION HEAT TRANSFER IN POROUS MEDIA[J]. Numerical Heat Transfer Part B Fundamentals, 2005, 47(2):157-177.
[6]Seta T, Takegoshi E, Okui K. Lattice Boltzmann simulation of natural convection in porous media[J]. Mathematics & Computers in Simulation, 2006, 72(2):195-200.
[7]徐超, 何雅玲, 杨卫卫等. 现代电子器件冷却方法研究动态[J]. 制冷与空调, 2003, 3(4):10-13.
Xu C,He Y L,Yang W W.Modern research about elecronics cooling method[J].Refrigeration and air-conditioning, 2003, 3(4):10-13.
[8]胡志勇.当今电子设备冷却技术的发展趋势[J].电子机械工程, 1999, 1: 2–5.
Hu Z Y.Development trends of cooling technique for today’s electronic equipment[J].Electro-mechanical engineering, 1999, 1: 2–5.
[9]崔昊杨,许永鹏,曾俊冬等.多电子元件及芯片组布局的热分析[J].上海电力学院学报,2013,29(5):459-462.
Cui H Y,Xu Y P,Zeng J D.Thermal analysis of the multi electronic component and chipset placement.[J].Journal of Shanghai university of electric power,2013,29(5):459-462.
[10]Nithiarasu P, Seetharamu K N, Sundararajan T. Natural convective heat transfer in a fluid saturated variable porosity medium[J]. International Journal of Heat & Mass Transfer, 1997, 40(16):3955-3967.
[11]S. Ergun. Fluid flow through packed columns[J]. Chemical Engineering Progress, 1952, 48(2):89-94.
[12]Qian Y H, D'Humières D, Lallemand P. Lattice BGK Models for Navier-Stokes Equation[J]. Europhysics Letters, 1992, 17(6BIS):479.
[13]Guo Z L,Zheng C G , and Shi B C. Discrete lattice effects on the forcing term in the lattice Boltzmann method[J]. Phy.Rev.E., 2002, 65(4): 046308.
[14]Guo Z L,Shi B C.Non—equilibrium extrapolation method for velocity and pressure boundary conditions in the lattice Boltzmann method[J]. Chinese Physics B:Ehglish edition, 2002, 11(4):366-374.
[15]Li Q,He Y L,Wang Y,Tang G H.An improved thermal lattice Boltzmann model for flows without viscous heat dissipation and compression work[J]. Int.J.Mod.Phys.C, 2008, 19(01):125-150.
[16]Peng Y, Shu C, Chew Y T. Simplified thermal lattice Boltzmann model for incompressible thermal flows.[J]. Phys Rev E Stat Nonlin Soft Matter Phys, 2003, 68(2 Pt 2):026701.
[17]Nithiarasu P, Ravindran K. A new semi-implicit time stepping procedure for buoyancy driven flow in a fluid saturated porous medium[J]. Computer Methods in Applied Mechanics & Engineering, 1998, 165(1–4):147-154.
[18]马崇扬, 张东辉, 王长茂. 内置方形发热体的封闭方腔自然对流数值研究[C].//全国反应堆热工流体学术会议暨中核核反应堆热工水力技术重点实2015 年度学术年会. 2015.

多孔介质方腔内置芯片热流耦合的LBM数值模拟

Lattice Boltzmann numerical simulation of flow thermal coupling in porous media with electronic chips

PDF

可视化

摘要/Abstract

引用本文

使用本文

参考文献

相关文章 15

编辑推荐

Metrics

[1]	张学民李银辉张山岭张梦军李金平王英梅. 多孔介质中CO₂-CH₄水合物置换过程的强化方法研究进展[J]. 过程工程学报, 2022, 22(4): 438-447.
[2]	陈浩徐则林颜克凤李小森陈朝阳李刚徐纯刚. 含盐蒙脱石中甲烷水合物的生成/分解特性及离子分布研究[J]. 过程工程学报, 2022, 22(1): 118-126.
[3]	魏格林李成祥葛蔚李金兵. 催化剂孔道结构设计及孔内反应-扩散耦合模拟[J]. 过程工程学报, 2021, 21(3): 265-276.
[4]	许飞陈飞国刘晓星吴昊鲁波娜刘志成滕加伟. 烯烃催化裂解反应器局部颗粒堆积结构的颗粒解析模拟[J]. 过程工程学报, 2021, 21(12): 1419-1429.
[5]	许肖飞郭旸旸高虹王雪朱廷钰. 水泥窑SCR烟气脱硝反应器内流场均匀性研究[J]. 过程工程学报, 2021, 21(12): 1440-1450.
[6]	赵建忠高强杨栋张驰. 近冰点多孔介质中甲烷水合物生成的温度敏感性[J]. 过程工程学报, 2021, 21(11): 1355-1363.
[7]	王志奇邹玉洁刘柏希张振康. 热风循环隧道烘箱的流场模拟及结构优化[J]. 过程工程学报, 2020, 20(5): 531-539.
[8]	司凯凯陈运法刘庆祝熊瑞孙广超刘开琪 . 陶瓷膜过滤器内流场及热致损毁机理模拟分析[J]. 过程工程学报, 2020, 20(11): 1329-1335.
[9]	陶源清颜克凤李小森陈浩. 盐离子对蒙脱石水化膨胀特性的影响[J]. 过程工程学报, 2020, 20(10): 1182-1189.
[10]	孙丽张楠刘新华范怡平. 边界条件对颗粒–流体对流传热的影响[J]. 过程工程学报, 2019, 19(6): 1075-1084.
[11]	魏舒婷钱付平程家磊肖鹏程唐莲花姜荣贺. 蜂窝状空气滤清器的流场分析及结构优化[J]. 过程工程学报, 2019, 19(2): 271-278.
[12]	王力军段叔平徐凌锋孙嘉君. 柱形流化床传热特性的数值模拟[J]. 过程工程学报, 2019, 19(1): 110-117.
[13]	鲁进利吕勇军韩亚芳钱付平. 细小槽道换热器内相变微胶囊悬浮液对流传热DPM模拟[J]. 过程工程学报, 2018, 18(5): 951-956.
[14]	余廷芳柳阿亮张莹王志强叶文林孙金丛. 孔隙分布对多孔介质内流动和传热的影响[J]. 过程工程学报, 2018, 18(3): 469-476.
[15]	曲践李保卫龚志军武文斐. O₂/CO₂气氛下单颗粒焦炭燃烧竞争效应的数值模拟[J]. 过程工程学报, 2017, 17(4): 725-731.