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›› 2009, Vol. 9 ›› Issue (4): 829-832.

• 材料工程专栏 • Previous Articles    

Wettability of Sn-Zn, Sn-Ag-Cu and Sn-Bi-Cu Lead-free Solder Alloys with Copper Substrate

ZHANG Xiao-rui, WANG Chun-lei, ZHAO Hong-xin, LI jian-qiang, TYUAN Zhang-fu   

  1. Key Laboratory of Multiphase Complex System, Institute of Process Engineering School of Metallurgical and Ecological Engineering, University of Science and Technology Beijing Key Laboratory of Multiphase Complex System, Institute of Process Engineering Key Laboratory of Multiphase Complex System, Institute of Process Engineering Institute of Process Engineering, Chinese Academy of Science
  • Received:2009-03-09 Revised:2009-05-05 Online:2009-08-20 Published:2009-08-20
  • Contact: ZHANG Xiao-rui,

Sn-Zn, Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性

张晓瑞 汪春雷 赵宏欣 李建强 袁章福   

  1. 中国科学院过程工程研究所多相复杂系统国家重点实验室 北京科技大学冶金与生态工程学院 中国科学院过程工程研究所多相复杂系统国家重点实验室 中国科学院过程工程研究所多相复杂系统国家重点实验室 中国科学院过程工程研究所多相反应重点实验室
  • 通讯作者: 张晓瑞

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Abstract: The wettability of Sn-Zn, Sn-Ag-Cu, Sn-Bi-Cu solder alloys on copper substrate was measured by sessile drop method. Among these solder alloys studied, the wettability of Sn-Bi-Cu alloy was excellent, at 530 K the contact angle between Sn-30Bi-0.5Cu alloy and Cu substrate was 26o. There was almost no contact angle hysteresis of the molten ternary eutectic Sn-3Ag-0.5Cu alloy. Adding Bi to Sn-based alloys could improve the wettability of alloys, while adding Cu could prevent the occurrence of dissolution of Cu substrate effectively. These research results may provide some theoretical basis for the use of lead-free solder alloys.

Key words: lead-free solder, wettability, ontact angle, hysteresis, interface layer

摘要： 采用静滴法对Sn-Zn, Sn-Ag-Cu, Sn-Bi-Cu锡基合金在铜基板上的润湿性进行了研究. 结果表明，Sn-Bi-Cu合金的润湿性良好，Sn-30Bi-0.5Cu合金在530 K时的接触角为26o，熔融的Sn-3Ag-0.5Cu共晶合金的接触角几乎不存在滞后性. 锡基合金中添加Bi元素可提高合金的润湿性，添加Cu元素可有效防止溶铜发生. 研究结果为无铅焊锡合金的应用提供了一定的理论依据.

关键词: 无铅焊料, 润湿性, 接触角, 滞后性, 界面层

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