Sn-Zn, Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性

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Wettability of Sn-Zn, Sn-Ag-Cu and Sn-Bi-Cu Lead-free Solder Alloys with Copper Substrate

ZHANG Xiao-rui; WANG Chun-lei; ZHAO Hong-xin; LI jian-qiang; TYUAN Zhang-fu

. 2009, (4): 829 -832 .

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