Welcome to visit The Chinese Journal of Process Engineering, Today is
Open Circuit Potential of Electroless Copper Plating on Tungsten Particles
LIU Qiang XU Rui-dong HE Shi-wei
Chin. J. Process Eng. . 2015, (6): 1012 -1017 .  DOI: 10.12034/j.issn.1009-606X.215285