Open Circuit Potential of Electroless Copper Plating on Tungsten Particles
LIU Qiang XU Rui-dong HE Shi-wei
Faculty of Metallurgical and Energy engineering, Kunming University of Science and Technology Faculty of Metallurgical and Energy engineering, Kunming University of Science and Technology Faculty of Metallurgical and Energy engineering, Kunming University of Science and Technology
LIU Qiang XU Rui-dong HE Shi-wei. Open Circuit Potential of Electroless Copper Plating on Tungsten Particles[J]. Chin. J. Process Eng., 2015, 15(6): 1012-1017.