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过程工程学报 ›› 2016, Vol. 16 ›› Issue (1): 125-131.DOI: 10.12034/j.issn.1009-606X.215307

• 过程与工艺 • 上一篇    下一篇

化学镀铜体系的电化学性能

刘强 徐瑞东 何世伟   

  1. 昆明理工大学冶金与能源工程学院 昆明理工大学冶金与能源工程学院 昆明理工大学冶金与能源工程学院
  • 收稿日期:2015-08-19 修回日期:2015-10-13 出版日期:2016-02-20 发布日期:2016-12-22
  • 通讯作者: 徐瑞东

Electrochemical Properties of Electroless Copper Plating Solution

LIU Qiang XU Rui-dong HE Shi-wei   

  1. Faculty of Metallurgical and Energy engineering, Kunming University of Science and Technology Faculty of Metallurgical and Energy engineering, Kunming University of Science and Technology Faculty of Metallurgical and Energy engineering, Kunming University of Science and Technology
  • Received:2015-08-19 Revised:2015-10-13 Online:2016-02-20 Published:2016-12-22
  • Contact: XU Rui-dong

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摘要： 对乙二胺四乙酸二钠(EDTA×2Na)与酒石酸钾钠(TART)双络合化学镀铜液进行了电化学研究，考察了络合剂与2,2￠-联吡啶对阴、阳极极化反应的影响. 结果表明，化学镀铜阳极极化受电化学与扩散混合控制，阴极极化受扩散控制；EDTA×2Na与TART通过竞争络合与竞争放电影响极化反应，而2,2￠-联吡啶以弥散吸附方式改变极化阻抗影响铜的沉积；在优化镀液(EDTA×2Na 13.35 g/L, TART 13.35 g/L, 2,2￠-联吡啶15 mg/L)中化学镀铜，镀速达14.83 mg/min，所得镀层均匀致密.

关键词: 化学镀铜, 电化学性能, 阻抗, 吸附, 乙二胺四乙酸二钠, 酒石酸钾钠

Abstract: The electroless copper plating solution containing ethylenediaminetetraacetic acid disodium salt (EDTA×2Na) and potassium sodium tartrate (TART) as complexing agents was measured by electrochemical workstation, and the effects of complexing agents and 2,2￠-bipyridine on cathode and anode polarization were examined. The results show that the anodic reaction is controlled by both chemical reaction and diffusion, while the cathodic reaction is mainly controlled by diffusion. Through the complexation competition and discharge competition between them, EDTA×2Na and TART affect the polarization. The diffuse electrical double layer on the surface of the electrode is affected by 2,2￠-bipyridine through adsorption and AC impedance, which ultimately impacts the copper deposition reaction. Under the optimum solution composition of 13.35 g/L of EDTA×2Na, 13.35 g/L of TART and 15 mg/L of 2,2′-dipyridyl, the average deposition rate can reach 14.83 mg/min. The copper film deposited on substrate has excellent properties.

Key words: electroless copper plating, electrochemical property, impedance, adsorption, EDTA×, 2Na, TART

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