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›› 2004, Vol. 4 ›› Issue (4): 340-346.

• 材料专栏 • 上一篇    下一篇

电沉积制备镍箔的SEM形貌和抗拉强度

刘宇星,郭占成,卢维昌,段岳   

  • 出版日期:2004-08-20 发布日期:2004-08-20

SEM Morphology and Tensile Strength of Nickel Foil by Electrodeposition

LIU Yu-xing,GUO Zhan-cheng,LU Wei-chang,DUAN Yue   

  1. Institute of Process Engineering, Chinese Academy of Science
  • Online:2004-08-20 Published:2004-08-20

摘要: 研究了电沉积法制取镍箔的实验条件,并对不同条件下得到的镍箔表面、断面SEM形貌以及抗拉强度进行了分析. 结果表明,动态条件下电沉积镍箔,能够显著提高其极限电流密度,此时SEM形貌显示沿电沉积箔的厚度增长方向,纯镍箔的晶粒逐渐增大. 加入5 g/L糖精能够有效地细化晶粒,并使镍箔表面更加光亮,其抗拉强度也有所提高.

关键词: 电沉积, 镍箔, SEM形貌, 力学性能

Abstract: The process conditions in the electrodeposition of nickel foil were studied. The SEM morphology of the surface and section of nickel foil was observed and associated with tensile strength. The results showed that the limiting current density could be greatly increased by dynamic electrodeposition. When the flow velocity was about 1.2 m/s the limiting current density reached 0.9 A/cm2. The SEM morphology showed that the grain size of nickel foil by dynamic electrodeposition was less than that by static condition. The grain size was decreased to about 1 μm. The section morphology showed that the crystal size of pure nickel foil grew gradually along the direction of thickness during electrodeposition. When adding additive, the surface of nickel foil was much brighter. The tensile strength was greatly increased when adding 5 g/L saccharin. The maximum tensile strength could reach 900 MPa.

Key words: electrodeposition, nickel foil, SEM morphology, mechanical properties